The EMPC 2023 Conference is dedicated to the latest developments in electronic packaging technologies covering a diverse range of sessions including power modules, high frequency, MEMS, sensors, sintering, embedded devices, interconnect materials, reliability and sustainability.
Look forward to presentations and posters from leading companies and academic institutions on emerging trends in electronics devices and associated technologies.
The Conference Programme features over 60 state of the art presentations and up to 25 posters containing the latest electronics packaging research.