The research was published today, 31 January, in Nature.
Dr Reinoud Lavrijsen, an author on the paper from the University of Cambridge, said: “Today’s chips are like bungalows – everything happens on the same floor. We’ve created the stairways allowing information to pass between floors.”
Researchers believe that in the future a 3D microchip would enable additional storage capacity on chips by allowing information to be spread across several layers instead of being compacted into one layer, as is currently the case.
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Image: 3D microchip
Image by LindenArtWork
Reproduced courtesy of the University of Cambridge
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